AMD is multiplying the value of 20nm with the UltraScale architecture and associated family of FPGAs and 3D ICs. Whether viewed from almost every attribute at the chip level or viewed when integrating multiple chips into one or fewer chips at the system level, designers will find compelling value metrics as they migrate from 28nm to 20nm devices.
UltraScale architecture delivers 3X higher system performance and integration for next generation packet processing and transport applications.
UltraScale architecture delivers TeraMACs of DSP performance in a cost-optimized footprint that requires only half the power and area to address next-generation waveform-processing applications.
UltraScale architecture delivers another 2X system performance and integration for next-generation 8K and 4K video processing applications.
UltraScale architecture delivers 2X higher system performance and 35% reduction in power for next-generation high performance computing applications.
Migration Path | Device Migration | System Integration |
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UltraScale architecture and Vivado™ Design Suite are co-optimized to enable a device utilization target of 90%, which can result in up to a 30% effective cost advantage relative to the nearest competitor. *System Logic Cell throughput=logic capacity x average realizable speed of the logic cells |
Applications that migrate from Virtex 7 to Virtex UltraScale FPGAs will typically leverage the full capacity of UltraScale devices for programmable systems integration, and the ability to double system level performance, reduce power and BOM cost by up to 50%, while still enjoying significant chip-level value enhancements.